{"id":3348,"date":"2021-03-17T08:14:01","date_gmt":"2021-03-17T07:14:01","guid":{"rendered":"https:\/\/store.ourplant.net\/pin-transfer-von-lotpaste-und-pick-place-von-smd-komponenten-auf-der-leiterplatte\/"},"modified":"2021-03-17T08:50:50","modified_gmt":"2021-03-17T07:50:50","slug":"pin-transfer-von-lotpaste-und-pick-place-von-smd-komponenten-auf-der-leiterplatte","status":"publish","type":"post","link":"https:\/\/mikromontage.shop\/en\/pin-transfer-von-lotpaste-und-pick-place-von-smd-komponenten-auf-der-leiterplatte\/","title":{"rendered":"Pin Transfer of Solder Paste and Pick & Place of components on PCB"},"content":{"rendered":"\t\t
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The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises several steps for assembling dies and SMD components on a PCB.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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The system is equipped with Direct Dispensing Unit (DDU) for processing pin transfer as well as areal application of solder paste on the component\u00b4s subside. In the video are shown various steps from pin transfer through standard pick & place to the direct dispensing process.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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The pin transfer is roughly a stamping process. So, in case of the pin transfer a tool transfer solder paste on the PCB. After dispensing solder paste on the pads of the PCB, SMD parts are picked up from a Waffle Pack and subsequently placed on the substrate. The smallest SMD component has a size of 0.3 mm x 0.3 mm. There are also tool changing units inside the working area, which can host different tools for pin transfer and pick & place purposes.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Larger components can be applied using direct dispensing capabilities of the DDU. Therefore the component is dipped into a reservoir of solder paste provided by the DDU.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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<\/div>\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises<\/p>\n","protected":false},"author":1,"featured_media":3346,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[714],"tags":[],"class_list":["post-3348","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-dispensing"],"yoast_head":"\nPin Transfer of Solder Paste and Pick & Place of components on PCB - microassembly.shop<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/mikromontage.shop\/en\/pin-transfer-von-lotpaste-und-pick-place-von-smd-komponenten-auf-der-leiterplatte\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Pin Transfer of Solder Paste and Pick & Place of components on PCB - 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