Feeding Equipment
Die Eject Unit with Single Wafer Changer

The wafer system consisting of Die Eject Unit and Single Wafer Changer is used to load wafers and to release components from the wafer foil to make them available to the machine for further processing. The components fixed on the wafer foil are released with a Needle Vacuum System and thus separated.

The Wafer Changer is used to feed a wafer to be processed and to remove the processed wafer. An integrated magazine enables to provide automatically up to 25 wafers with a size of 4” to 8” alternately one after the other.

The wafers are fed in without opening the doors of the machine.

The Wafer Changer is equipped with a laser safety window, which allows the wafer system to be used in machines with laser applications.