The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises several steps for assembling dies and SMD components on a PCB. The system is e...

Jet-Dispensing, Jetting or pulsing means the application of dispensing media (adhesive, underfill, coating, etc.) by means of a dispensing jet. This makes it possible to transfer the dispensing materi...

The combination of special jet valves and a well defined feed pressure on the dispensing fluid causes the formation of a so called “jet” as depicted in Fig. 1. The “jet” it-self is defined as a drople...

An appropriate substance is provided at a defined height on a structurable substrate (foil). The substance height on the foil largely determines the amount of material transferred. The transfer of the...

Häcker Automation has developed a direct dispensing unit (DDU), shown in Fig. 1. This unit provides a defined and constant amount of substance for application to a component. Fig. 2 exemplifies how SM...

The following statements and their detailed explanations should facilitate the selection of suitable dispensing materials. The dispensing materials are referred below as substance. As the properties o...

Bonding optical components mainly requires adhesives with suitable optical properties. Due to small dimensions and high accuracy requirements of the bonding process, the dispensing process also must b...

Dispensing of fluid materials is one of the core technologies in micro assembly industry. Dispensing techniques range from dispensing of adhesive dots over dispensing of solder paste on eletrical cont...

irect dispensing is a dispensing method for applying liquid and jellylike substances directly to the workpiece’s underside. The principle is similar to that of a stamping or pin transfer process. The ...