The Direct Dispensing Unit is provides a homogeneous layer at the subside of microelectronic components within a process.
The component is also the stamping tool for direct dispensing. Thus, the adhesive is always applied at the component subside, making it possible to realise even the smallest placements.
Within the pin transfer process, process-specific stamping tools transfer the desired pattern. Similar to drop-shaped needle dispensing or jet dispensing, the Direct Dispensing Unit applies a homogeneous and reproducible adhesive layer.
This prevents certain areas of components or substrates from being inadvertently wetted with adhesives.
Due the modular design of the Direct Dispensing Unit, the station can be dismantled by the user to the relevant parts, which makes the maintenace and cleaning easier.