Feeding Equipment
Die Eject Unit
69.000,00 € excl. VAT
Description
The Die Eject Unit is used to load wafers and to release components from the wafer foil to make them available to the machine for further processing. The components fixed on the wafer foil are released with a Needle Vacuum System and thus separated.
The Die Eject Unit can handle wafer in sizes from 4” to 8”.
The Die Eject Unit loads automatically wafers that are provided in a delivery system. The delivery system can be a laser-safe Single Wafer Loader or an automatic, laser-safe Single Wafer Changer. These are available separately.
Additional information
| Dimensions in mm (W x D x H) | 363,5 x 594 x 151 |
|---|---|
| Weight in kg | 16,7 |
| Max. wafer size in inch / mm | 8 / 200 |
| Voltage in V | 24 |
| Max. current in A | 5 |
| Communication interface | Ethernet, UNICAN |
