Feeding Equipment
Single Wafer Changer
30.000,00 € excl. VAT
Description
The Single Wafer Changer provides wafers individually for the Die Eject Unit.
The Wafer Changer is used to feed a wafer to be processed and to remove the processed wafer. An integrated magazine enables to provide automatically up to 25 wafers with a size of 4” to 8” alternately one after the other.
The wafers are fed in without opening the doors of the machine.
The Wafer Changer is equipped with a laser safety window, which allows the wafer system to be used in machines with laser applications.
Additional information
| Dimensions in mm (W x D x H) | 394.5 x 350 x 439.5 |
|---|---|
| Weight in kg | 21,5 |
| Max. wafer size in inch / mm | 8 / 200 |
| Voltage in V | 24 |
| Max. current in A | 3 |
| Communication interface | UNICAN |
