Feeding Equipment
Single Wafer Changer
30.000,00 € excl. VAT
Description
The Single Wafer Changer provides wafers individually for the Die Eject Unit.
The Wafer Changer is used to feed a wafer to be processed and to remove the processed wafer. An integrated magazine enables to provide automatically up to 25 wafers with a size of 4” to 8” alternately one after the other.
The wafers are fed in without opening the doors of the machine.
The Wafer Changer is equipped with a laser safety window, which allows the wafer system to be used in machines with laser applications.
Additional information
| Dimensions in mm (W x D x H) |
394.5 x 350 x 439.5 |
|---|---|
| Weight in kg |
21,5 |
| Max. wafer size in inch / mm |
8 / 200 |
| Voltage in V |
24 |
| Max. current in A |
3 |
| Communication interface |
UNICAN |