The Laser Head is used for selective laser soldering and is primarily used for processes in the optics, medical technology and automotive sectors.
The Laser Head is used in processes where standard soldering methods are non-applicable. This is especially the case for temperature-sensitive components and components that require selective assembly or subsequent contacting.
The processing head is equipped with an integrated laser source, an optical system and process control and monitoring technology.
The soldering profiles inside the process are adjustable and analysable. The temperature control at the soldering joint is realized by an integrated pyrometer.